posted by on Jun 6
Scientists at the IBM have shown off a prototype device which is layered with thousands of minute cooling veins. Scientists say it could be a solution to the increasing amount of heat pumped out by chips as they become smaller and more densely packed with components. Heat is seen as one of the major hurdles of producing ever smaller and quicker chips. It is the by-product of the movement of electrons through the tiny wires connecting the millions of components on a modern processor.
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Water Cooled Processor Chips
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